File:Bodge-Back.jpg
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Size of this preview: 797 × 599 pixels. Other resolutions: 319 × 240 pixels | 638 × 480 pixels | 1,021 × 768 pixels | 1,280 × 963 pixels | 2,560 × 1,925 pixels | 4,000 × 3,008 pixels.
Original file (4,000 × 3,008 pixels, file size: 2.82 MB, MIME type: image/jpeg)
Summary
Back side of an Expansion Pak that was bodged by Nintendo (prior to adding the resistor into the PCB design)
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 06:57, 2 January 2024 | | 4,000 × 3,008 (2.82 MB) | LambBrainz (talk | contribs) | Back side of an Expansion Pak that was bodged by Nintendo (prior to adding the resistor into the PCB design) |
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